TSV inspection module
Ultra high-speed TSV sensor head module
Function: sensing TSV depth; trench depth; oxide, nitride, PR, PI film thickness
Specifications：
|
Model Name |
Hivia |
Horus |
|
Max via Aspect Ratio |
15 |
30 |
|
TSV Depth |
max. 100 µm |
max. 200 µm |
|
TSV Diameter (recommended) |
5 µm – 20 µm |
3 µm - 10 µm |
|
Single TSV Detectable |
- |
Yes (at min. 5 µm via) |
|
Reference Working Distance |
23±1 mm |
23±1 mm |
|
Focal Spot |
46 µm |
23 µm |
|
Repeatability on Depth 3σ |
<0.1 µm |
<0.09 µm |
|
Accuracy on Depth |
0.3 µm |
0.2 µm |
|
Sampling Time (per acquisition) |
200 msec |
200 msec |
|
Smart Light Source Status Monitoring |
Optional |
Yes |
|
Weight (main) |
1 kgw |
1 kgw |
|
Operation Indicator |
LED indicator on the light source |
|
|
Light Source |
VIS to NIR |
|
|
Power Requirements |
Light source: 5V (max 15W, 3A); Camera: 2.7W (max); Optical sensor : USB 5V (max 2.5W, 0.5A) |
|
|
Environment |
0–50 °C (32–122 °F), 20–80 % relative humidity, non-condensing |
|
* Reference data, depends on sample quality; specs up to utilization and modification