TSV inspection module
Ultra high-speed TSV sensor head module
Function: sensing TSV depth; trench depth; oxide, nitride, PR, PI film thickness
Specifications：
| Model Name | Hivia | Horus |
| Max via Aspect Ratio | 15 (at 5 µm via) |
30 (at 3 µm via) |
| TSV Depth | max. 100 µm | max. 200 µm |
| TSV Diameter (recommended) | 5 µm – 20 µm | 3 µm - 10 µm |
| Single TSV Detectable | - | Yes (at min. 5 µm via) |
| Reference Working Distance | 23±1 mm | 23±1 mm |
| Focal Spot | 46 µm | 23 µm |
| Repeatability on Depth 3σ | <0.1 µm | <0.09 µm |
|
Accuracy on Depth |
0.3 µm |
0.2 µm |
|
Sampling Time (per acquisition) |
200 msec |
200 msec |
|
Smart Light Source Status Monitoring |
Optional |
Yes |
|
Weight (main) |
1 kgw |
1 kgw |
| Operation Indicator | LED indicator on the light source | |
| Light Source | VIS to NIR | |
| Power Requirements | Light source: 5V (max 15W, 3A); Camera: 2.7W (max); Optical sensor : USB 5V (max 2.5W, 0.5A) | |
| Environment | 0–50 °C (32–122 °F), 20–80 % relative humidity, non-condensing | |
* Reference data, depends on sample quality; specs up to utilization and modification