Automatic TSV (Through Silicon Via) /Trench inspection system

ViaMaster A100


Function: automatic measurement for TSV depth; oxide, nitride, PR, PI film thickness; wafer profile

Specification：
Spot size (3 options): 50μm、25μm、7μm
TSV aspect ratio: >30 @ Top CD 3~5 μm
TSV depth Repeatability: < 0.2 μm (for depth 170 μm)
Film thickness range: 500 Å ~ 30 μm
Wafer stage XYZ (4 DOF)