ViaMaster A200
Function: automatic measurement for TSV depth; oxide, nitride, PR, PI film thickness; wafer profile; wafer tilt angle
•Spot size (3 options): 50μm、25μm、7μm
•TSV aspect ratio: >30 @ Top CD 3~5 μm
•TSV depth Repeatability: < 0.2 μm (for depth 170 μm)
•Film thickness range: 500 Å ~ 30 μm
•Wafer stage XYZabg (6 DOF)，adjustable wafer tilt angle