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Automatic TSV (Through Silicon Via) inspection system ViaMaster A1003
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Home Products Si Processing Inspection Systems Automatic TSV (Through Silicon Via) inspection system ViaMaster A100
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Automatic TSV (Through Silicon Via) inspection system ViaMaster A100

Function: automatic measurement for TSV depth; oxide, nitride, PR, PI film thickness; wafer profile

ViaMaster A100

Specifications:


System Model

ViaMaster A100

Wafer size

8 in. (or 12 in. option)

Inspection items

TSV (f3~5mm)*1, CD, step height, wafer profile, wafer thickness; 3D map visualization

Light source

LED & wide band lighting

Working distance (for multi lens)

Min 12mm, Max 65mm

Lens

4X, 20X (or other selections), confocal

Chuck

Standard (or Customized) and vacuum

Air

VAC -80kPaCDA 5~7kg/cm^2

System configuration

XYZC (400x350x10mm, 360°) with linear scales 1um resolution

Electrostatic discharger

600mm

Cleanliness

Class 100

Networking

SECS/GEM

Main controller

Windows 11 with height-speed USB, 4-port GbE card

System power

220VAC

Safety compatibility

SEMI S2



Note1: The specifications may vary depending on the model of the inspection head module you select. Contact us for other needs.

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