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Automatic TSV (Through Silicon Via) / Deep Trench inspection system ViaMaster A2003
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Home Products Si Processing Inspection Systems Automatic TSV (Through Silicon Via) / Deep Trench inspection system ViaMaster A200
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Automatic TSV (Through Silicon Via) / Deep Trench inspection system ViaMaster A200

Function: automatic measurement for TSV / deep-trench depth; oxide, nitride, PR, PI film thickness; wafer profile; wafer tilt angle

•Specifications:

System Model

ViaMaster A200

Wafer size

12 in.

Inspection items

TSV(f2.5~5mm)*2, CD, overlay, step height, wafer profile, wafer thickness, wafer tilt; 3D map visualization 

Light source

LED & wide band lighting & laser

Working distance (for multi lens)

Min 12mm, Max 65mm

Lens

4X, 20X (or other selections), confocal, tilt sensor

Chuck

Wafer lift pin (or Customized) and vacuum

Air

VAC -80kPaCDA 5~7kg/cm^2

System configuration

XYZABC (450x350x60mm, 1° 1° 4°) with linear scales 1um resolution

Electrostatic discharger

600mm

Cleanliness

Class 100

Networking

SECS/GEM

Main controller

Windows 11 with height-speed USB, 4-port GbE card

System power

220VAC

Safety compatibility

SEMI S2



Note2: The specifications may vary depending on the model of the inspection head module you select. Contact us for other needs.
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